{"id":17508,"date":"2018-11-09T12:00:36","date_gmt":"2018-11-09T11:00:36","guid":{"rendered":"https:\/\/packaging-journal.de\/?p=17508"},"modified":"2018-10-25T17:02:29","modified_gmt":"2018-10-25T15:02:29","slug":"sps-ipc-drives-it-and-automation-grow-together","status":"publish","type":"post","link":"https:\/\/packaging-journal.de\/en\/sps-ipc-drives-it-und-automation-wachsen-zusammen\/","title":{"rendered":"SPS IPC Drives: IT and automation continue to grow together"},"content":{"rendered":"<p>If there is one trade fair that is predestined for the topic of \u201eIndustry 4.0\u201c, then it is SPS IPC Drives. The 29th edition of the trade fair for smart and digital automation starts on Tuesday, 27 November 2018, at the Nuremberg Exhibition Centre and ends on 29 November. The organising company Mesago is once again expecting more exhibitors this year. In order to do justice to the growing interest in the trade fair, the new Hall 3C has been integrated into SPS IPC Drives.<\/p>\n<p>Around 1,700 exhibiting companies are expected to present themselves from the <strong>27 to 29 November 2018<\/strong> in the <strong>Nuremberg Trade Fair<\/strong> are expected by the organisers. This means that the number of exhibitors will once again increase slightly. Visitors - there were 70,264 last year - can now look forward to the <strong>17 Halls<\/strong> about the offer.<\/p>\n<figure id=\"attachment_17513\" aria-describedby=\"caption-attachment-17513\" style=\"width: 581px\" class=\"wp-caption alignnone\"><img fetchpriority=\"high\" decoding=\"async\" class=\"wp-image-17513\" title=\"Virtual reality at the SPS IPC Drives 2017\" src=\"https:\/\/packaging-journal.de\/wp-content\/uploads\/2018\/10\/SPS_TDG20171128_SPS_1826.jpg\" alt=\"Virtual reality at the SPS IPC Drives 2017\" width=\"581\" height=\"387\" srcset=\"https:\/\/packaging-journal.de\/wp-content\/uploads\/2018\/10\/SPS_TDG20171128_SPS_1826.jpg 1200w, https:\/\/packaging-journal.de\/wp-content\/uploads\/2018\/10\/SPS_TDG20171128_SPS_1826-600x400.jpg 600w, https:\/\/packaging-journal.de\/wp-content\/uploads\/2018\/10\/SPS_TDG20171128_SPS_1826-300x200.jpg 300w, https:\/\/packaging-journal.de\/wp-content\/uploads\/2018\/10\/SPS_TDG20171128_SPS_1826-768x512.jpg 768w, https:\/\/packaging-journal.de\/wp-content\/uploads\/2018\/10\/SPS_TDG20171128_SPS_1826-1024x683.jpg 1024w\" sizes=\"(max-width: 581px) 100vw, 581px\" \/><figcaption id=\"caption-attachment-17513\" class=\"wp-caption-text\">How can virtual reality (VR) be used industrially? SPS IPC Drives will provide ideas on this. (Image: Mesago\/Thomas Geiger)<\/figcaption><\/figure>\n<p>The <strong>SPS IPC Drives<\/strong> is using the claim \u201e<strong>Smart and digital automation<\/strong>\u201c. This emphasises the fact that the IT and automation sectors are growing ever closer together. Many stands will be focussing on industrial web services, digital business platforms, virtual product developments and cloud computing. \u201eThe claim underlines the convergence of automation and IT as well as the positive development of the trade fair in the course of industrial digitalisation towards holistic automation and Industry 4.0,\u201c says Christian Wolf, Chairman of the Exhibitor Advisory Board.<\/p><div class=\"packa-in-post-alle packa-entity-placement\" style=\"text-align: center;\" id=\"packa-3282947357\"><div id=\"packa-3558132336\"><a data-no-instant=\"1\" href=\"https:\/\/packaging-journal.de\/en\/newsletter\/\" rel=\"noopener\" class=\"a2t-link\" target=\"_blank\" aria-label=\"PJ Self-promotion English 03\"><!--noptimize--><img src=\"https:\/\/packaging-journal.de\/wp-content\/uploads\/2026\/01\/PJ-Eigenwerbung-English-03.png\" alt=\"\"  srcset=\"https:\/\/packaging-journal.de\/wp-content\/uploads\/2026\/01\/PJ-Eigenwerbung-English-03.png 840w, https:\/\/packaging-journal.de\/wp-content\/uploads\/2026\/01\/PJ-Eigenwerbung-English-03-300x75.png 300w, https:\/\/packaging-journal.de\/wp-content\/uploads\/2026\/01\/PJ-Eigenwerbung-English-03-768x192.png 768w, https:\/\/packaging-journal.de\/wp-content\/uploads\/2026\/01\/PJ-Eigenwerbung-English-03-18x5.png 18w, https:\/\/packaging-journal.de\/wp-content\/uploads\/2026\/01\/PJ-Eigenwerbung-English-03-332x83.png 332w, https:\/\/packaging-journal.de\/wp-content\/uploads\/2026\/01\/PJ-Eigenwerbung-English-03-664x166.png 664w, https:\/\/packaging-journal.de\/wp-content\/uploads\/2026\/01\/PJ-Eigenwerbung-English-03-688x172.png 688w\" sizes=\"(max-width: 840px) 100vw, 840px\" width=\"840\" height=\"210\"  style=\" max-width: 100%; height: auto;\" \/><!--\/noptimize--><\/a><\/div><\/div>\n<h2>Some key topics are given new places<\/h2>\n<p>The newly opened, <strong>new hall 3C<\/strong> in the south-west corner of the Nuremberg exhibition centre will be directly integrated into SPS IPC Drives. Sylke Schulz-Metzner, Head of Division at Mesago for SPS IPC Drives, emphasises that \u201ewith Hall 3C we can offer our exhibitors another modern, light-flooded hall and thus make the trade fair offer even more tangible\u201c.<\/p>\n<figure id=\"attachment_17514\" aria-describedby=\"caption-attachment-17514\" style=\"width: 581px\" class=\"wp-caption alignnone\"><img decoding=\"async\" class=\"wp-image-17514\" title=\"Exhibition programme at the SPS IPC Drives 2017\" src=\"https:\/\/packaging-journal.de\/wp-content\/uploads\/2018\/10\/SPS_TDG20171128_SPS_2018.jpg\" alt=\"Exhibition programme at the SPS IPC Drives 2017\" width=\"581\" height=\"387\" srcset=\"https:\/\/packaging-journal.de\/wp-content\/uploads\/2018\/10\/SPS_TDG20171128_SPS_2018.jpg 1200w, https:\/\/packaging-journal.de\/wp-content\/uploads\/2018\/10\/SPS_TDG20171128_SPS_2018-600x400.jpg 600w, https:\/\/packaging-journal.de\/wp-content\/uploads\/2018\/10\/SPS_TDG20171128_SPS_2018-300x200.jpg 300w, https:\/\/packaging-journal.de\/wp-content\/uploads\/2018\/10\/SPS_TDG20171128_SPS_2018-768x512.jpg 768w, https:\/\/packaging-journal.de\/wp-content\/uploads\/2018\/10\/SPS_TDG20171128_SPS_2018-1024x683.jpg 1024w\" sizes=\"(max-width: 581px) 100vw, 581px\" \/><figcaption id=\"caption-attachment-17514\" class=\"wp-caption-text\">It's a familiar sight at SPS IPC Drives: Visitors are densely packed in the aisles. (Image: Mesago\/Thomas Geiger)<\/figcaption><\/figure>\n<p>The additional hall leads to a <strong>Minimal change in hall utilisation<\/strong>. Some of the main themes will be given a new location. For example, some exhibitors from the \u201eMechanical Manufacturing\u201c theme area will now move from Hall 10.1 to the new Hall 3C near Hall 2, which is also dedicated to this theme.<\/p><div id=\"packa-466745257\" class=\"packa-inhalt packa-entity-placement\"><!--noptimize--><script async src=\"https:\/\/pagead2.googlesyndication.com\/pagead\/js\/adsbygoogle.js?client=ca-pub-2686439340972671\" crossorigin=\"anonymous\"><\/script>\r\n<ins class=\"adsbygoogle\" style=\"display:block;text-align:center\" data-ad-layout=\"in-article\" data-ad-format=\"fluid\" data-ad-client=\"ca-pub-2686439340972671\" data-ad-slot=\"6171251825\"><\/ins>\r\n<script>\r\n     (adsbygoogle = window.adsbygoogle || []).push({});\r\n<\/script><!--\/noptimize--><\/div>\n<p>There will also be changes in Halls 5 and 6, where the focus in future will be on software and IT in manufacturing. Visitors will also find the \u201e<strong>Industrial communication<\/strong>\u201c. Apart from these changes, the hall layout remains unchanged. It was only thoroughly revised last year.<\/p>\n<h2>Hackathon: Start-ups generate new ideas<\/h2>\n<p>SPS IPC Drives is also one of the most important industry events because of its supporting programme. The new trade fair claim goes hand in hand with a new event in the supporting programme. For the first time, SPS IPC Drives is organising a \u201e<strong>Hackathon<\/strong>\u201c. Up to 15 start-up companies will be given the opportunity to generate new ideas within 48 hours together with renowned industry partners under the motto \u201eDigital ideas for smart automation\u201c.<\/p>\n<blockquote><p>\u201eI am convinced that this year's trade fair will once again be an absolute highlight for exhibitors and visitors, also due to the favourable economic conditions.\u201c<br \/>\n<strong>Christian Wolf<\/strong>, Chairman of the SPS-IPC Drives Exhibitor Advisory Board<\/p><\/blockquote>\n<p>The hackathon starts before the actual trade fair, namely on 25 November 2018. <strong>ten-minute idea presentations<\/strong> will then take place two days later at the trade fair forum. An expert jury will select the three best ideas. Prize money totalling 15,000 euros is up for grabs.<\/p>\n<figure id=\"attachment_17512\" aria-describedby=\"caption-attachment-17512\" style=\"width: 581px\" class=\"wp-caption alignnone\"><img decoding=\"async\" class=\"wp-image-17512\" title=\"Lecture forums at the SPS IPC Drives 2017\" src=\"https:\/\/packaging-journal.de\/wp-content\/uploads\/2018\/10\/SPS_TDG20171128_SPS_1735.jpg\" alt=\"Lecture forums at the SPS IPC Drives 2017\" width=\"581\" height=\"387\" srcset=\"https:\/\/packaging-journal.de\/wp-content\/uploads\/2018\/10\/SPS_TDG20171128_SPS_1735.jpg 1200w, https:\/\/packaging-journal.de\/wp-content\/uploads\/2018\/10\/SPS_TDG20171128_SPS_1735-600x400.jpg 600w, https:\/\/packaging-journal.de\/wp-content\/uploads\/2018\/10\/SPS_TDG20171128_SPS_1735-300x200.jpg 300w, https:\/\/packaging-journal.de\/wp-content\/uploads\/2018\/10\/SPS_TDG20171128_SPS_1735-768x512.jpg 768w, https:\/\/packaging-journal.de\/wp-content\/uploads\/2018\/10\/SPS_TDG20171128_SPS_1735-1024x683.jpg 1024w\" sizes=\"(max-width: 581px) 100vw, 581px\" \/><figcaption id=\"caption-attachment-17512\" class=\"wp-caption-text\">The ZVEI and VDMA associations are once again offering the opportunity to discuss current industry developments in their forums. (Image: Mesago\/Thomas Geiger)<\/figcaption><\/figure>\n<p>The following have proved their worth <strong>Joint stands<\/strong>. Four are on offer this year: \u201e<strong>Automation meets IT<\/strong>\u201c and \u201e<strong>MES goes automation<\/strong>\u201c in Hall 6, \u201e<strong>Wireless in Automation<\/strong>\u201c in Hall 5 and \u201eAMA Centre for Sensor, Measuring and Testing Technology\u201c in Hall 4A. The VDMA and ZVEI associations are organising lecture forums in Hall 6 to discuss current topics in the industry.<\/p>\n<p>During the first two days of the fair, the \u201e<strong>Automation 4.0 Summit<\/strong>\u201c will take place. It will focus on topics such as the industrial use of edge computing, TSN and OPC UA, IoT platforms and sensor technology.<\/p>","protected":false},"excerpt":{"rendered":"SPS IPC Drives will take place from 27 to 29 November 2018 in Nuremberg. A new hall will also be occupied. The new claim is: Smart and digital automation","protected":false},"author":1,"featured_media":17511,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"__cvm_playback_settings":[],"__cvm_video_id":"","rank_math_description":"","rank_math_focus_keyword":"","rank_math_title":"","csco_display_header_overlay":false,"csco_singular_sidebar":"","csco_page_header_type":"","csco_page_load_nextpost":"","csco_post_video_location":[],"csco_post_video_location_hash":"","csco_post_video_url":"","csco_post_video_bg_start_time":0,"csco_post_video_bg_end_time":0,"footnotes":"","_links_to":"","_links_to_target":""},"categories":[28,7],"tags":[55,1022,59,94,33],"class_list":{"0":"post-17508","1":"post","2":"type-post","3":"status-publish","4":"format-standard","5":"has-post-thumbnail","7":"category-aus-dem-magazin","8":"category-messen-und-veranstaltungen","9":"tag-automatisieren-und-robotik","10":"tag-industrie-4-0","11":"tag-software-und-steuern","12":"tag-sps-ipc-drives","13":"tag-veranstaltungen","14":"cs-entry","15":"cs-video-wrap"},"acf":[],"vimeo_video":null,"_links":{"self":[{"href":"https:\/\/packaging-journal.de\/en\/wp-json\/wp\/v2\/posts\/17508","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/packaging-journal.de\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/packaging-journal.de\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/packaging-journal.de\/en\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/packaging-journal.de\/en\/wp-json\/wp\/v2\/comments?post=17508"}],"version-history":[{"count":0,"href":"https:\/\/packaging-journal.de\/en\/wp-json\/wp\/v2\/posts\/17508\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/packaging-journal.de\/en\/wp-json\/wp\/v2\/media\/17511"}],"wp:attachment":[{"href":"https:\/\/packaging-journal.de\/en\/wp-json\/wp\/v2\/media?parent=17508"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/packaging-journal.de\/en\/wp-json\/wp\/v2\/categories?post=17508"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/packaging-journal.de\/en\/wp-json\/wp\/v2\/tags?post=17508"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}