{"id":1857,"date":"2017-09-28T23:00:00","date_gmt":"2017-09-28T21:00:00","guid":{"rendered":"http:\/\/dev.packaging-journal.de\/motek-bondexpo-stuttgart-messen-neu-sortiert\/"},"modified":"2019-10-18T13:36:23","modified_gmt":"2019-10-18T11:36:23","slug":"motek-bondexpo-stuttgart-trade-fairs-reorganised","status":"publish","type":"post","link":"https:\/\/packaging-journal.de\/en\/motek-bondexpo-stuttgart-messen-neu-sortiert\/","title":{"rendered":"Motek and Bondexpo in Stuttgart: Leading trade fairs reorganised"},"content":{"rendered":"

Visitors to the 36th Motek and the eleventh Bondexpo, which open their doors at the Stuttgart Trade Fair Centre from 9 to 12 October, will be taking a new approach. Instead of offering a colourful mix of sectors in each hall as before, trade fair visitors will now be offered a \u201emodular sub-sorting\u201c. Packaging technology is also an important part of the trade fair.<\/p>\n

The 36th Motek and the 11th Bondexpo from 9 to 12 October will feature a slightly different concept. The previously colourful Sector mix<\/strong> in each hall has been partially cancelled. Both still form Trade fairs<\/strong> all segments of the Production and assembly automation<\/strong> and the Adhesive technology<\/strong> from.<\/p>\n

As \u201eModular partial sorting<\/strong>\u201c is how Rainer Bachert, long-time project manager of the Motek and Bondexpo trade fairs, describes the adjustments to the concept of the two events from 9 to 12 October at the Stuttgart Exhibition Centre. The 36th Motek, according to the organisers one of the world's leading trade fairs for all areas of industrial automation, and its little sister, the bonding technology trade fair Bondexpo, which is also being held for the eleventh time, will use exhibition halls 3 to 8 this year.<\/p>

\"\"<\/a><\/div><\/div>\n
\"Rainer
Rainer Bachert<\/figcaption><\/figure>\n

Rainer Bachert<\/strong>, project manager of the Motek and Bondexpo trade fairs, explains the new \u201emodular sub-sorting\u201c of the offerings in the Stuttgart exhibition halls. However, the aim remains the same: to cover all areas of production and assembly automation.<\/p>\n

At previous Motek trade fairs, a colourful mix of exhibiting companies was presented in each hall. This is now changing, initially in Halls 5 and 6, where the thematic focus will be on \u201eturnkey assembly systems\u201c and \u201escrewdriving and fastening technology\u201c. Assembly systems<\/strong> can also be seen in Hall 6, which also features \u201eJoining\/Bonding Technology\u201c.<\/p>\n

Shorter distances due to block-like arrangement of the halls<\/strong><\/h2>\n

\u201eThe block-like arrangement avoids long distances and allows quicker changes between the even and odd-numbered hall sections,\u201c outlines Bettina Schall<\/strong>, Managing Director of trade fair organiser P. E. Schall GmbH & Co. KG, the new Motek hall organisation, \u201eThe additional thematic structuring will make it easier for visitors to find their way around. Trade visitors<\/strong> This is because, on the one hand, they can find the entire range of products and services in one area and, on the other, they can easily switch to the next process chain area.\u201c<\/p>\n

Packaging technology<\/strong> has always been an important component of the Motek concept, confirms Bettina Schall: \u201eAs the packaging process is seen more than ever as an integral part of an overall process, it is logical that there is a direct link between production, quality control and labelling, and finally packaging and order picking. This requires high-performance handling and robot systems as well as material flow equipment and the corresponding peripherals. All of this will be comprehensively presented at Motek. In the future, and with the realisation of ,Industry 4.0\u2032<\/strong>-structures, packaging technology will take up even more space.\u201c<\/p>\n

The range of products and services at the leading trade fair for production and assembly automation remains unchanged, according to Rainer Bachert<\/strong> as usual: Motek and Bondexpo focus on \u201eProcess expertise<\/strong> by linking robotics\/handling technology, feeding\/material flow, gripping\/processing and joining\/connecting\u201c. Motek provides information about the trade fair programme, which also includes lectures and discussions, in the form of print and online trade fair guides and a dedicated Motek app.<\/p>","protected":false},"excerpt":{"rendered":"Visitors to the 36th Motek and the eleventh Bondexpo will be able to explore new paths. Instead of offering a colourful mix of sectors in each hall as in the past, trade fair visitors will now be offered a modular sub-sorting. Packaging technology is also an important part of the trade fair.","protected":false},"author":1,"featured_media":1855,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"__cvm_playback_settings":[],"__cvm_video_id":"","rank_math_description":"","rank_math_focus_keyword":"","rank_math_title":"","csco_display_header_overlay":false,"csco_singular_sidebar":"","csco_page_header_type":"","csco_page_load_nextpost":"","csco_post_video_location":[],"csco_post_video_location_hash":"","csco_post_video_url":"","csco_post_video_bg_start_time":0,"csco_post_video_bg_end_time":0,"footnotes":"","_links_to":"","_links_to_target":""},"categories":[7],"tags":[55,36,42383,33],"class_list":{"0":"post-1857","1":"post","2":"type-post","3":"status-publish","4":"format-standard","5":"has-post-thumbnail","7":"category-messen-und-veranstaltungen","8":"tag-automatisieren-und-robotik","9":"tag-markt","10":"tag-motek","11":"tag-veranstaltungen","12":"cs-entry","13":"cs-video-wrap"},"acf":[],"vimeo_video":null,"_links":{"self":[{"href":"https:\/\/packaging-journal.de\/en\/wp-json\/wp\/v2\/posts\/1857","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/packaging-journal.de\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/packaging-journal.de\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/packaging-journal.de\/en\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/packaging-journal.de\/en\/wp-json\/wp\/v2\/comments?post=1857"}],"version-history":[{"count":0,"href":"https:\/\/packaging-journal.de\/en\/wp-json\/wp\/v2\/posts\/1857\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/packaging-journal.de\/en\/wp-json\/wp\/v2\/media\/1855"}],"wp:attachment":[{"href":"https:\/\/packaging-journal.de\/en\/wp-json\/wp\/v2\/media?parent=1857"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/packaging-journal.de\/en\/wp-json\/wp\/v2\/categories?post=1857"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/packaging-journal.de\/en\/wp-json\/wp\/v2\/tags?post=1857"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}