Manufacturers of thin-wall packaging are currently facing major challenges: Price increases for energy and materials are squeezing margins and increasing planning uncertainty, while constantly growing requirements for recyclability mean more complex manufacturing processes and products. At the Thin-Wall Packaging Day, Engel will be presenting solutions for injection moulding companies to make the production of plastic packaging sustainable, profitable and future-proof.
ENGEL presents at the Thin-Wall Packaging Day on 8 February at the company headquarters in Schwertberg/Austria the current state of the art and an outlook for further developments for the Thin-wall injection moulding. The event combines technical presentations and insights based on concrete best-practice examples with interactive workshops on practical application examples, thus offering a comprehensive overview of Engel's innovations for the packaging market.
„In recent years, we have worked intensively on the further development of our injection moulding machines and solutions for thin-wall injection moulding. The requirements from the market have always been decisive for all our projects.“
Christoph Lhota, Head of the Packaging business unit at ENGEL
The exhibits in particular convey the answers to the challenges of the market: an all-electric e-motion 280 injection moulding machine demonstrates the energy-saving potential for demanding thin-wall applications. On an e-speed 280, Engel emphasises with the latest development stage in the rPET injection moulding its role in the circular economy. The duo speed 500 is a première, which demonstrates the practical use of fast two-platen injection moulding machines for thin-wall injection moulding. Choosing the right injection moulding machine for the respective application is the basis for making the most of the machine's performance. In addition to the e-motion, e-speed and duo speed series already mentioned, the particularly compact, all-electric e-mac series will also be presented as an efficient solution for mid-performance applications.
As a special highlight, guest speaker Christoph Holz, an expert in the field of digitalisation, will take the audience along with him into the factory of the future - with artificial intelligence.
„For us, Thin-Wall Packaging Day is not just about presenting our solutions, but also about proving ourselves as an innovative, reliable partner for the industry. We want to establish a dialogue with our customers and approach the market even more closely.“
Ivica Puskaric, Sales Manager Packaging at Engel
Source: Engel
