Schneider Electric will be presenting its latest solutions for the packaging industry at Fachpack 2025 in Nuremberg. The focus will be on technologies that anchor robotics as an integral part of the overall machine architecture and thus combine automation, flexibility and sustainability.
From 23 to 25 September, the company will be presenting approaches for safe human-machine collaboration, adaptive motion control and digital integration at the joint Packaging Valley stand.
The manufacturer emphasises that digital innovations along the entire value chain are crucial for future-proofing packaging systems. With automation, robotics, AI, digital twins and next-generation transport systems, Schneider Electric supports companies in their transformation to more flexible and efficient production processes.
One highlight is the Lexium MC12 multi carrier transport system, which moves, positions or groups objects in machines and, in combination with digital twin technologies, enables processes to be adapted quickly. In addition, the EcoStruxure solutions for packaging machines offer intelligent, AI-supported functions for greater efficiency and sustainability. With the Modicon M660 Motion System, Schneider Electric is also presenting a scalable, standardised I/O solution with a decentralised design that covers a wide range of applications.
Schneider Electric says it wants to show how packaging companies can make their production more sustainable and resilient - a decisive factor in a dynamic market environment.
Source: Schneider Electric
Schneider Electric at Fachpack 2025: Hall 3C, Stand 415
