With the new Technomelt Supra 079 Eco Cool hotmelt adhesive, Henkel Adhesive Technologies has developed an innovative solution that combines bio-based materials with energy-efficient packaging.
The adhesive Reduces energy consumption by up to 40 degrees Celsius and at the same time reduces CO2-emissions. Technomelt Supra 079 Eco Cool consists of 49 per cent bio-based raw materials and also contains 30 per cent ISCC mass-balanced material. The low application temperature of the adhesive contributes to a reduction in energy consumption and simultaneously reduces the workload on staff from vapours and the risk of burns.
Handle is addressing several trends in the packaging industry with this product, in particular the growing pressure on companies to implement more sustainable packaging solutions. By combining the Supra Cool and Supra Eco technologies, Technomelt Supra 079 Eco Cool offers a more sustainable packaging solution. Reduction of CO2-emissions by up to 32 per cent compared to conventional adhesives. The adhesive is also fully recyclable and compatible with the paper recycling process, as demonstrated by the cyclos-HTP certification was confirmed.
Source: Henkel Adhesive Technologies
