Around 45 participants from the wooden packaging industry met in Dortmund for this year's packaging conference organised by the Bundesverband Holzpackmittel, Paletten, Exportverpackung e.V. (HPE). For two days, the focus was on current technical and legal topics in the industry.
The event focussed on practical presentations and internal meetings of the technical committee and the „HPE Certified Custom Packaging“ specialist group. Thomas Hamfeldt from GGW GmbH explained ways of minimising liability for storage in the context of packaging orders. Dr Markus Rambacher from Berufsgenossenschaft Holz und Metall (BGHM) presented approaches to improving occupational safety under the motto „Packaging the future safely together“. André Töpler from Corpac presented technical solutions in the field of corrosion protection packaging and placed these in the context of current customer requirements and legal specifications.
Software update and the future of wooden packaging
A key topic was the development status of the new HPE design software PaC-Express („Pallet-and-Case-Express“). The 3D static and construction software enables customised designs and structural analyses for export packaging. HPE standard cases and slides are already predefined and dynamically scalable. PaC-Express is being developed in collaboration with the software specialist itech, known for its Pallet-Express application.
In addition, it was shown how PaC-Express can contribute to fulfilling the requirements of the European Packaging Ordinance (PPWR) in future with the HPECycle take-back and recycling system. Synergies between the two systems would be created, particularly with regard to technical documentation.
HPE Managing Director Marcus Kirschner drew a positive conclusion: „Regulatory issues such as the PPWR as well as insurance topics and occupational health and safety are becoming increasingly intertwined. The combination of industry-specific information from experts and networking among colleagues offers great added value for companies in the industry to better understand these interrelationships.“ The next packaging conference is already planned for 2026.
Source: HPE
