Low adhesive requirement and simple applications

At Empack 2024, Robatech will be showcasing solutions for process optimisation and ensuring high order quality, such as the EasyLine.

Empack will take place in Bern from 24 to 25 January 2024. Robatech will be showcasing solutions for process optimisation and ensuring high application quality. The EasyLine has been developed for simple hot melt applications with low adhesive requirements.  

Efficiency and simplicity in the gluing process do not have to go hand in hand with a loss of application quality. This is proven by Robatechs Small EasyLine adhesive application system. The minimalist application system is equipped with all basic functions and practical features. The components, consisting of the Easy melter, the Rio heated hose and the Twist spray head, are coordinated and work as a team. EasyLine was specially developed for the Bonding of trays, folding boxes, paper cups and similar products with an adhesive requirement of up to 2.5 kg/h and impresses with its excellent price/performance ratio.

Vision is the company's flagship melter and stands for Process reliability and precision when gluing primary and secondary packaging. The energy-efficient melter reliably keeps the adhesive viscosity constant and ensures a stable adhesive pressure. Vision opens up scope for installation in new and existing packaging lines. The melter is easy and safe to operate. A glance at the Smart Terminal is all it takes to record all operating and status information.

Under the motto «You don't need much. Just the right thing.» the new GreenSaver service scrutinises the adhesive application process and identifies potential savings. GreenSaver's inspection report also suggests targeted measures to reduce costs and improve the sustainability balance.

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Source: Robatech

Robatech at the Empack: Stand G26

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