From the oven straight into the packaging

The new Cooling@Packing system from Multivac enables baked goods to be packaged immediately after baking. The vacuum application is about to be launched on the market.
Multivac Multivac
The vacuum application for cooling baked goods integrates the cooling process into a thermoforming packaging machine. (Image: Multivac)

The new Cooling@Packing system from Multivac enables baked goods to be packaged immediately after baking. The vacuum application is about to be launched on the market.

The Multivac Cooling@Packing system is a vacuum application that integrated the cooling process for baked goods into a thermoforming packaging machine. This allows baked goods to be packaged immediately after baking, keeping them fresh and long-lasting for longer. Conventional cooling processes for baked goods are usually carried out using cooling spirals at ambient temperature or in a separate cooling tunnel. Both approaches take up a lot of space in production facilities and require high investment costs.

„With our Cooling@Packing system, which is about to be launched on the market, baked goods can be placed directly from the oven into the open packaging cavities of a thermoforming packaging machine - also automatically with the help of loading robots. By vacuuming the chambers of the packaging machine, the baked goods are cooled from 95°C to around 30°C within a few seconds. Vacuuming generates evaporation energy, which is released by the evaporation of the product's own moisture and cools the baked goods in the process.“

Thomas Fickler, Product Manager at Multivac

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As a result, the Cooling@Packing system enables companies to make savings in terms of to the smaller space requirement for cooling the baked goods, on the other hand by Reduced energy consumption for product cooling. The risk of product contamination during the cooling process can also be minimised in this way. In addition, production capacity can be increased through shorter baking times without compromising product quality. The new solution can be integrated into Multivac thermoforming packaging machines for the high-performance segment and has already won several awards.

Source: Multivac