At SPS 2025, Sick will be showing how sensor data can analyse and optimise production and logistics processes. The trade fair presentation will focus on networked sensor solutions, AI-supported image processing and scalable IIoT platforms that optimise machines and processes throughout their entire life cycle.
With the Sick Nova image processing platform, the company offers a powerful software basis for various 2D and 3D vision sensors such as the InspectorP and Ruler series. Thanks to AI-supported deep learning, even complex quality and inspection tasks can be implemented quickly - without the need for specialised programming knowledge. The SensorApps enable flexible customisation to specific requirements in areas such as food processing, packaging or mechanical engineering.
Robot guidance with 3D vision
The PLB robot guidance system allows objects to be precisely localised and picked up in a chaotic arrangement - for example in containers or on pallets. Combined with deep learning and powerful 3D cameras, robot systems can be used flexibly in changing applications. The simple integration into standard robotic systems significantly lowers the entry barrier for automated pick-and-place processes.
Autonomous mobility with integrated AI
Sick has developed the Visionary AI Assist driver assistance system for use in depots and outdoor areas. It combines smart 3D imaging with integrated AI and thus ensures reliable environment monitoring and personal and collision avoidance for mobile machines. The system is designed as an all-in-one solution - including data processing and AI logic, configurable via a web browser.
Complete control of the material flow
Sick offers a comprehensive portfolio for material tracking - from barcode, RFID and hybrid tags to stationary identification systems such as the Ident Gate and tracking systems such as Aldis for tracking forklift movements. This increases transparency and efficiency along the entire intralogistics process - from goods receipt to dispatch.
IIoT platform for end-to-end digitalisation
The scalable IIoT platform from Sick enables end-to-end lifecycle management of sensors and systems. It supports the creation of digital twins, integration into fieldbus systems and secure OT-IT integration. Application-specific solutions analyse recorded data and help to optimise process reliability, system availability and material flows based on data.
One example of the combination of compact design and high-precision data acquisition is the OD200: a miniaturised distance sensor with exceptional measurement stability - even on dark or irregular surfaces. Ideal for use in automotive, mechanical engineering or electronics production.
Source: Sick
