The Shanghai World of Packaging (swop) will take place every year from 2024. Under the umbrella of the interpack alliance, the trade fair will focus even more strongly on the needs of the local market and strengthen international business relationships in the processing and packaging industry.
Even before the start of swop 2023, it is already clear that the trade fair will take place again in 2024. One reason for this is the increasing demand from exhibitors and visitors. On the other hand shorter innovation cycles as a result of the changes in the packaging industry, particularly with regard to sustainability and digitalisation. The annual event creates a platform for presenting innovations and developments in the field of processing and packaging in a timely manner. Previously, the event was held every two years.
„With this step, we are responding to the needs of the very dynamic Chinese packaging market. Closer synchronisation of the event is meeting with great interest here. By participating regularly, companies can increase their visibility, boost customer loyalty and strengthen their market position.“ Thomas Dohse, Director of the interpack alliance
After the end of the coronavirus crisis In China, a continuous recovery of the economy as well as the resurgence of the trade fair industry. The response from exhibitors to swop 2023, which is jointly organised by Messe Düsseldorf Shanghai and Adsale Exhibition Services, is already strong.
Packaging growth market
With the expansion of the global consumer goods market and the development of technological innovations the packaging industry has become an important factor in China's economic growth. The industry is becoming increasingly specialised, with a focus on innovation, environmental protection and sustainability. The presentation of new products, the promotion of technological dialogue and the establishment of business contacts within the industry have become particularly important, and trade fairs are the ideal platform for achieving these goals.
The swop covers a wide range of topics such as artificial intelligence, sustainable packaging, smart factory, printing and labelling, processing and packaging components, manufacturing of packaging containers, e-commerce and logistics packaging, packaging materials and design as well as personalised packaging. Users receive here innovative omnichannel packaging solutions and intelligent processing and packaging production lines. This is complemented by an extensive supporting programme and special areas.
The swop finds 2023 from 22 to 24 November in Shanghai will take place. Around 700 exhibitors and 25,000 trade visitors from Germany and abroad are expected to attend. In 2024, the swop is scheduled for 18 to 20 November and will also take place in Shanghai. For companies from Germany, participation is subsidised by the federal government. Exhibitors can present themselves together with other German companies under the „Made in Germany“ brand and receive a discounted complete trade fair package as well as extensive support.
Source: Messe Düsseldorf