Valco Melton's fully electronically controlled EcoStitch applicator improves bond strength, saves up to 70% adhesive and reduces downtime
For years, paper bags have been produced in plants for the manufacture of paper carrier bags. Pneumatic hot melt application systems for the application of carry handles for carrier bags until the recent introduction of fully electronically controlled technology. Valco Melton's EcoStitch applicator features innovative adhesive technology that is suitable for handle forming and application, bottom taping and reinforcement, and bag seam bonding.
The advantages of the fully electronically controlled EcoStitch technology for bag production are virtually unlimited. Thanks to the Customer orientation The electronically controlled systems improve the overall equipment effectiveness (OEE) by reducing adhesive consumption, downtime and consumable parts, and offer pocket manufacturers a direct competitive advantage over their competitors.
Increased efficiency thanks to Elktronik
In the past, manufacturers used compressed air (pneumatic systems) because it was readily available and met the original design criteria based on older hot melt adhesive systems. Nevertheless, these pneumatic systems experienced some long-term problems, including the constant and costly replacement of parts, the reduction in solenoid performance and the use of dynamic seals, which account for the majority of inefficient system performance.
Electric gear pumps and electronic valves require almost 90 % fewer seals and spare parts than pneumatic pumps and valves. By eliminating the number of moving parts, fully electronically controlled systems eliminate the possibility of failure caused by worn or faulty seals.
EcoStitch also differs from all other gluing processes in terms of adhesive consumption. The innovative application of the glue as a dot matrix, which can be configured by the customer for every product requirement, enables Reduction of adhesive consumption by 40 to 70 %. In most cases, this guarantees full amortisation in just 4 months.
The adhesive strength is also favoured by a dot and spacing pattern. With an adhesive bead pattern, only the bead ends ensure high adhesion. EcoStitch dots apply less adhesive, but offer a higher adhesion. Larger bonding surface and more independent adhesion with targeted fibre penetration.
Each point is flattened 360 degrees by compression, providing more bonding surface while maintaining heat penetration. Valco Melton's solution has passed every strength test developed by the most stringent customers, proving its reliability.
Award for special sustainability
Sustainability continues to be a key factor in packaging design and equipment layout. As the packaging industry is forced to reduce its overall carbon footprint, electronically controlled systems offer an attractive solution to achieve these goals.
In recognition of Valco Melton's commitment to environmental values, the EcoStitch technology for the Sustainability Awards 2019 as it offers proven environmental benefits and reduces adhesive consumption.
Source: Valco Melton
