A new hot melt application head from Robatech delivers the smallest dot and bead application for demanding bonding applications in the packaging, packaging materials and printing industries. The smallest installation dimensions, speed and durability characterise this spray head.
The new spray head SpeedStar Compact from Robatech is, according to the company, one of the fastest and most compact application heads in the High-precision hot melt application. With up to 800 switching cycles per second it enables very small bead and dot application for particularly demanding and clean bonding at high production speeds. It is suitable for the contactless application of low to medium viscosity, thermoplastic hotmelt adhesives.
To ensure that the electromechanical spray head guarantees precision in adhesive application over the entire life cycle of approx. 500 million operating cycles Robatech has integrated an automatic stroke adjustment. This eliminates the need for manual readjustments and reduces maintenance-related downtime.
Smallest installation dimensions and high protection class
Compared to its predecessor, the SpeedStar Diamond, the new electric head is more compact in terms of hardware. Technically optimised and thus more durable. It is also 46 mm smaller due to the electronic part being offset from the head. With the new design, Robatech has taken into account the limited space available in the industry and enables customers to Space-saving integration in systems and complete machines. The higher protection class IP55 allows better use in wet areas.
The SpeedStar Compact is available as a single and multiple head in short or long versions and will be on display at the Robatech stand at the upcoming trade fairs.
Source: Robatech
