From the magazine

Where is the packaging industry heading?

Times are anything but rosy. War in Europe, exploding energy prices, shortage of raw materials and high inflation. Against this background, the packaging industry met at Fachpack in Nuremberg – and was surprisingly optimistic. At the end, six packaging experts shared their impressions of the trade fair and their personal assessments of where the packaging industry is heading in these times in our packaging journal Live Talk.

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That was Fachpack 2022

More than 1,150 exhibitors, around 32,000 visitors, three days of packaging in the spotlight – that’s a brief numerical summary of this year’s Fachpack. But that would hardly do justice to the full scope and significance of the packaging trade fair. After all, at the end of September in Nuremberg, not only were hands shaken, business cards exchanged and kilometres made, but ideas were compared, innovations presented and business relationships initiated. And packaging journal was right in the middle of it all.

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Siemens Healthineers packs sustainably with R.WEISS

A complex product range requires a complex packaging process? You might think so. But the automation of the packaging process of Siemens Healthcare Diagnostics Products GmbH shows: With a competent partner like R.WEISS Packaging GmbH & Co KG, flexible solutions based on modular design can be realised. This is also the case here, for which an intelligent UNIROB turnkey system for packaging diagnostic products was developed.

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Image of a paper bag in a field of sugar beets

When sugar beets pack sugar

In the Netherlands, the paper manufacturer, Crown Van Gelder, offers paper made from sugar beet pulp, using a material that already accumulates.

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Image of a plastic tube

Great tubes

The European Tube Manufacturers Association (etma) awarded the Tube of the Year prize and the jury paid special attention to sustainability.

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Image of a cardboard packaging

Copied from nature

Three young designers from the Stuttgart Media University have taken the opening mechanism of the snapdragon as a model for a packaging.

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